Why Are Advanced Packaging Techniques Like 3D and 2.5D Becoming Popular?

Introduction

Advanced packaging techniques such as 3D and 2.5D are rapidly gaining popularity in the semiconductor industry due to their ability to meet the evolving demands of modern electronic devices.

Key Reasons for the Rise of 3D and 2.5D Packaging

• Miniaturisation and Space Efficiency
  • As consumers demand smaller, sleeker devices like smartphones, wearables, and tablets, manufacturers need to fit more functionality into ever-tighter spaces. 3D and 2.5D packaging allow for vertical stacking or close placement of chips, dramatically reducing the overall footprint of electronic components
• Enhanced Performance and Bandwidth
  • By stacking chips (3D) or placing them side-by-side on a shared interposer (2.5D), these techniques reduce the distance signals must travel. This leads to faster data transfer, higher bandwidth, and lower latency—ideal for high-performance applications such as AI, data centres, and gaming
• Improved Power Efficiency
  • Shorter interconnects between chips mean less energy is lost during data transmission. This results in lower power consumption, which is crucial for battery-powered devices and energy-intensive applications
• Better Thermal Management
  • Advanced packaging can help dissipate heat more efficiently, a critical factor as chips become more powerful and densely packed. Efficient heat management ensures reliability and extends device lifespan
• Integration of Diverse Components
  • 2.5D and 3D packaging make it possible to combine different types of chips (logic, memory, analog) in a single package, enabling complex system-on-chip solutions and supporting the trend towards system-level integration
• Support for Next-Generation Technologies
  • The rise of AI, IoT, and Industry 4.0 is pushing the need for higher integration, faster processing, and more efficient power usage. Advanced packaging technologies are essential for enabling these future-forward applications

Summary Table: Benefits of 3D vs. 2.5D Packaging

Feature	2.5D Packaging	3D Packaging
Integration	Data centres, AI, high-end consumer devices	Vertical stacking (through-silicon vias)
Performance	High bandwidth, reduced latency	Even higher bandwidth, minimal latency
Size Reduction	Significant	Maximum
Power Efficiency	Improved	Superior
Thermal Management	Good	Excellent
Application Examples	HPC, AI accelerators, mobile devices	Data centers, AI, high-end consumer devices

Summation

Advanced packaging techniques like 3D and 2.5D are becoming popular because they enable smaller, faster, and more efficient electronic devices while supporting the integration of increasingly complex systems.

These methods are crucial for meeting the demands of today’s high-performance applications and the ongoing trend toward miniaturisation in consumer electronics

References:

1. https://www.precedenceresearch.com/3d-ic-and-25d-ic-packaging-market
2. https://www.maximizemarketresearch.com/market-report/3d-semiconductor-packaging-market/243005/
3. https://www.factmr.com/report/3d-semiconductor-packaging-market
4. https://www.microchipusa.com/electrical-components/why-semiconductor-packaging-matters
5. https://resources.pcb.cadence.com/blog/2023-2-5d-vs-3d-packaging
6. https://www.globenewswire.com/news-release/2024/11/26/2987605/0/en/3D-Semiconductor-Packaging-Market-Size-to-Achieve-USD-57-19-Bn-by-2034.html
7. https://www.tek.com/en/component-solutions/2-5d-3d-packaging
8. https://www.globaltrademag.com/how-3d-and-2-5d-ic-packaging-solutions-enhance-electronics/
9. https://www.globalsmt.net/industry-news/3d-semiconductor-packaging-market-higher-growth-during-2022-2032/
10. https://semiwiki.com/forum/threads/emerging-trends-and-key-markets-in-2-5d-and-3d-semiconductor-packaging.21396/